DAMP & WET EPOXY COMPOUNDS

TECBOND LO-MOD LV is a 2 component, low modulus (flexible enough so that it adjusts to the stresses of impact and thermal variation), low viscosity, wet/damp 100% solids epoxy based compound. This versatile product can be used as a primer, sealer, bonder, adhesive and repair matrerial. Excellent for bonding old to new concrete, metal, ceramic, wood and most plastics. This LO-MOD LV formulation is highly chemical and abrasive resistant. Aggregate may be added to produce a strong, epoxy patching compound to fill cracks, holes and depressions in concrete.

TECBOND LO-MOD MV is a 2 component, low modulus, medium viscosity, wet/damp 100% solids epoxy based compound. This versatile product can be used as a binder for skid-resistant aggregate and a topping for fabric-reinforced surfacing systems. Excellent as a non-skid applications, concrete bonding agent and general adhesive. This LO-MOD formulation is highly chemical and abrasive resistant. Aggregate may be added to produce a strong epoxy patching material to fill cracks, holes and depressions in concrete.

TECBOND LO-MOD GEL is a 2 component, low modulus, high viscosity gel, wet/damp versatile product can be used as a general adhesive or for all types of vertical and overhead repairs. This LO-MOD GEL formulation is highly chemical and abrasive resistant. Aggregate may be added to produce a strong epoxy patching material to fill cracks, holes and depressions in concrete.

TECBOND PATCH is a 3 component, low modulus, high viscosity el, wet/damp 100% solids epoxy based compound. This versatile product is packed in a kit from (Resin, Hardener and Quartz Aggregate) ready to be used as epoxy patching material for wet or dry applications. It can also be used for vertical and overhead repairs. This PATCH formulation is highly chemical and abrasive resistant. Excellent as patching material to fill cracks, holes and depressions in concrete.

TECBOND HI-MOD LV is a 2 component, high modulus (Hi-Mod compounds possess rigidity necessary for certain applications), wet/damp 100% solids epoxy based compound. This versatile product can be used as a primer, sealer, bonder, adhesive and repair material. Excellent for bonding old to new concrete, metal, ceramic, wood and most plastics. This HI-MOD LV formulation is highly chemical and abrasive resistant. Aggregate may be added to produce a strong, epoxy patching compound to fill cracks, holes and depressions in concrete. Fast set available for cold temps.

TECBOND HI-MOD MV is a 2 component, high modulus (rigid), wet/damp 100% solids epoxy based compound. This versatile product can be used as a sealer, bonder, adhesive and repair material. Excellent for joint repair material, anchoring bolts, posts, dowels, etc. Bond old to new concrete, metal, ceramic, wood and most plastics. This HI-MOD MV formulation is highly chemical and abrasive resistant. Aggregate may be added to produce a strong, epoxy patching compound to fill cracks, holes and depressions in concrete. Fast set available.

TECBOND HI-MOD GEL is a 2 component, non-sag, high modulus (rigid), wet/damp 100% solids epoxy based compound. This versatile product can be used as a sealer, bonder, adhesive and repair material. Excellent as a general adhesive, anchoring bolts, dowels, posts, etc. Bond concrete, metal, ceramic, wood and most plastics. May be used for all vertical and overhead repairs. Chemical and abrasive resistant. Aggregate may be added to produce a strong, epoxy patching compound to fill cracks, holes and depressions in concrete. Fast set available for cold temperatures.

TECBOND HI-MOD MV-EXT is a two component, high modulus, medium viscosity, wet/damp, 100% solids epoxy adhesive and binder. This formulation allows for an extended working time thus a longer pot life after which it is mixed. Excellent for bonding new to old concrete, metal, wood, anchoring and grouting with the addition of aggregate into the mixture.